|
2006 PWB Technology Expo Products Category
|
|
|
P001
|
Rigid Electronic Board (Sigle/Double/Multilayer)
|
|
|
P002
|
Flex Rigid Board
|
|
|
P003
|
Sectional Process(es) of Electronic Board Manufacturing
|
|
|
P004
|
Base Materials for Rigid Electronic Board
|
|
|
P005
|
Equipment & Materials for ArtWork Generation, PhotoTooling for Manufacturing PWB
|
|
|
P006
|
Equipment & Materials for Mechanical Processes for Manufacturing PWB
|
|
|
P007
|
Equipment & Materials for Laminating Processes for Manufacturing PWB
|
|
|
P008
|
Equipment & Materials for Surface Finishing/Cleaning/Treatment Processes for Manufacturing PWB
|
|
|
P009
|
Equipment & Materials for Plating Processes(Panel/Pattern/Contact Plating etc.) for Manufacturing PWB
|
|
|
P010
|
Equipment & Materials for Imaging Processes for Manufacturing PWB
|
|
|
P011
|
Equipment & Materials for Etching Processes and Resist Removal Processes of Manufacturing PWB
|
|
|
P012
|
Equipment & Materials for Solder Application and Finishing Processes Processes for Manufacturing PWB
|
|
|
P013
|
Equipment and Materials for Electronic Board Manufacturing Process (Die Fablication, etc.)
|
|
|
P014
|
Equipment for Manufacturing
|
|
|
P015
|
Environmental Control and Recycle Equipment and Maintenance Facilities
|
|
|
P016
|
Rigid PWB Technology related Information and Services
|
|
|
P017
|
Rigid PWB Technology related Publications
|
|
2006 FPC Expo Products Category
|
|
|
F001
|
Flexible Electronic Board(Sigle/Double/Multilayer/Buid-up)
|
|
|
F002
|
TAB/COF/TCP
|
|
|
F003
|
Base Materials for Flexible Electronic Board(Tape/Film Materials and Copper Foils)
|
|
|
F004
|
Applications Products used by FPCs(FPD Module, Drive Module, etc.)
|
|
|
F005
|
Equipment & Materials for Mechanical Processes for Manufacturing FPC/TAB/COF/TCP
|
|
|
F006
|
Equipment & Materials for Laminating Processes for Manufacturing FPC/TAB/COF/TCP
|
|
|
F007
|
Equipment & Materials for Surface Finishing/Cleaning/Treatment Processes for Manufacturing FPC/TAB/COF/TCP
|
|
|
F008
|
Equipment & Materials for Imaging Processes for Manufacturing FPC/TAB/COF/TCP
|
|
|
F009
|
Puncing/Cutting machines for Manufacturing FPC/TAB/COF/TCP
|
|
|
F010
|
Equipment & Materials for Die Fabrication for Manufacturing FPC/TAB/COF/TCP
|
|
|
F011
|
Miscellaneous Equipment and Materials for Manufacuturing FPC/TAB/COF/TCP
|
|
|
F012
|
Equipment for Manufacturing FPC/TAB/COF/TCP
|
|
|
F013
|
Environmental Control and Recycle Equipment and Maintenance Facilities
|
|
|
F014
|
FPC Technology realted Information, Services
|
|
|
F015
|
FPC Technology realted Publications
|
|
2006 DES(Design and manufacturing Engineering Solution) Expo Products Category
|
|
|
D001
|
Application Software
|
|
|
D002
|
Electronic Circuits Design
|
|
|
D003
|
System Consultation Service
|
|
|
D004
|
EMS/ODM
|
|
|
D005
|
Communication Network Solution
|
|
|
D006
|
CAE Tools (CAD/CAM/CIM)
|
|
|
D007
|
Product Design Technology
|
|
|
D008
|
Case Design
|
|
|
D009
|
Model Development System for Trial Manufacture
|
|
|
D010
|
Molding
|
|
|
D011
|
Rapid Prototyping System
|
|
|
D012
|
DES related Information, Services, etc.
|
|
|
D013
|
DES related Publicatioins
|
|
2006 MicroTEST Products Category
|
|
|
T001
|
Automatic Optical Inspection Equipment
|
|
|
T002
|
X-ray Inspection Equipment
|
|
|
T003
|
Evaluation Systems
|
|
|
T004
|
Tester
|
|
|
T005
|
Special Tools for Testing and Measuring/Inspection System
|
|
|
T006
|
2D/3D Measuring Equipment
|
|
|
T007
|
Measuring Instruments
|
|
|
T008
|
Analyzers
|
|
|
T009
|
Test/Inspection Business
|
|
|
T010
|
Sensing Imaging Technology Systems
|
|
|
T011
|
Virtual Reality technology
|
|
|
T012
|
MicroTEST related Information, Serivces
|
|
|
T013
|
MicroTEST related Publications
|
|
2006 Microelectronics Show Products Category
|
|
|
M001
|
Products with High-density/High-frequency electronics packaging technologies
|
|
|
M002
|
High-density Substrates/Interpozers
|
|
|
M003
|
IC Packages( including Sustem in Package)
|
|
|
M004
|
Electronic Components
|
|
|
M005
|
Embedded Packaging Board
|
|
|
M006
|
Wafer Process (including materials)
|
|
|
M007
|
Display Device/Optical Device
|
|
|
M008
|
Thick Film and Thin Film Materials(inluding paste material)
|
|
|
M009
|
Materials related to Interconnection
|
|
|
M010
|
Materials realated to Electronics Packaging(including Solders,Lead-free solder,Anisotropic Conductive, etc)
|
|
|
M011
|
Bonding/Mounting /Dispenser/Past Printing Machines
|
|
|
M012
|
Equipment for manufacturing
|
|
|
M013
|
Environmental Consideration Technologies, Recycle System
|
|
|
M014
|
Electronic Packaging (Jisso) related Information, Services
|
|
|
M015
|
Electronic Packaging (Jisso) related Pulications
|
|
Eco-pavilion
|
|
|
E002
|
Environmental Friendly Base Material
|
|
|
E003
|
Green Process Materials
|
|
|
E004
|
Environmental Friendly Machines for Manufacturing Electronic Boards
|
|
|
E006
|
Environmental Friendly Machines on Electronic Packaging
|
|
|
E007
|
Environmental Friendly Electronic Boards
|
|
|
E008
|
Environmental Friendly Electronic Devices
|
|
|
E009
|
Environmental Friendly Machines
|
|
|
E010
|
Eco-Processing System
|
|
|
E011
|
Recycle System
|
|
|
E012
|
Environmental related Testing and Analyzing
|
|
|
E013
|
Consulting Services for Ecology
|
|
|
E014
|
Others
|
|
|
E005
|
Environmental Friendly Materials on Electronic Packaging
|